Data Center
AI training, cloud computing, and big data are driving explosive growth in data center traffic demand. Optical modules are evolving toward high-speed rates of 400G, 800G, and even 1.6T, with multi-channel parallel transmission becoming the mainstream trend. This requires optical modules to incorporate optoelectronic chips that feature compact packaging, high data rates, and lower power consumption.
Our core chip solutions, including 4x200G TIA, 4x200G VCSEL drivers, and 8x200G silicon photonics modulators, feature multi-channel, highly integrated designs. Equipped with high-compensation equalizers and adaptive technologies, they ensure precise conversion and amplification of high-speed optical signals, enabling optical modules to maintain superior performance. These solutions are suitable for 800G and 1.6T high-speed optical modules, LPO, NPO, and other application scenarios, providing reliable support for large-scale computing interconnects in data centers.
Our core chip solutions, including 4x200G TIA, 4x200G VCSEL drivers, and 8x200G silicon photonics modulators, feature multi-channel, highly integrated designs. Equipped with high-compensation equalizers and adaptive technologies, they ensure precise conversion and amplification of high-speed optical signals, enabling optical modules to maintain superior performance. These solutions are suitable for 800G and 1.6T high-speed optical modules, LPO, NPO, and other application scenarios, providing reliable support for large-scale computing interconnects in data centers.
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